S-1/ACLAY
MOBIX LABS, INC
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Mobix Labs, Inc. (ticker: CLAY) is a fabless semiconductor company developing radio-frequency and millimeter-wave integrated circuits for 5G and next-generation wireless applications. The company entered public markets via a de-SPAC business combination with Chavant Capital Acquisition Corp, a blank-check vehicle that completed its IPO in 2021 and was sponsored by Chavant Capital. The transaction established Mobix Labs as a publicly traded entity in the semiconductor and wireless technology sector. On July 9, 2026, the company filed an S-1/A amendment with the SEC, updating its registration statement. Sign up for full data on SpacDesk to explore complete filing histories, sponsor details, and analytics across the SPAC universe.